环氧树脂胶黏剂

环氧树脂胶黏剂 > 环氧树脂结构胶 魔力蓝

环氧树脂结构胶TK-魔力蓝 双组分、全透明环氧胶粘剂 透明黏胶剂 不发黄黏胶剂 基材粘结剂 粘石头胶水 粘金属胶水 粘陶瓷胶水 粘玻璃胶水 粘宝石胶水 粘水晶胶水环氧树脂结构胶TK-魔力蓝 双组分、全透明环氧胶粘剂 透明黏胶剂 不发黄黏胶剂 基材粘结剂 粘石头胶水 粘金属胶水 粘陶瓷胶水 粘玻璃胶水 粘宝石胶水 粘水晶胶水环氧树脂结构胶TK-魔力蓝 双组分、全透明环氧胶粘剂 透明黏胶剂 不发黄黏胶剂 基材粘结剂 粘石头胶水 粘金属胶水 粘陶瓷胶水 粘玻璃胶水 粘宝石胶水 粘水晶胶水环氧树脂结构胶TK-魔力蓝 双组分、全透明环氧胶粘剂 透明黏胶剂 不发黄黏胶剂 基材粘结剂 粘石头胶水 粘金属胶水 粘陶瓷胶水 粘玻璃胶水 粘宝石胶水 粘水晶胶水环氧树脂结构胶TK-魔力蓝 双组分、全透明环氧胶粘剂 透明黏胶剂 不发黄黏胶剂 基材粘结剂 粘石头胶水 粘金属胶水 粘陶瓷胶水 粘玻璃胶水 粘宝石胶水 粘水晶胶水环氧树脂结构胶TK-魔力蓝 双组分、全透明环氧胶粘剂 透明黏胶剂 不发黄黏胶剂 基材粘结剂 粘石头胶水 粘金属胶水 粘陶瓷胶水 粘玻璃胶水 粘宝石胶水 粘水晶胶水


Description:


TIEAKO®“魔力蓝” is a two-component, fully transparent epoxy adhesive that bonds a variety of substrates


such as stone, metal,ceramic, glass, precious stones and crystal. It cures rapidly at  room temperature and


provides processing strength in about 45minutes.The product has high transparency and no yellowing after


curing, which is very suitable for jewelry processing, crystal,glass processing and other industries.




Recommended Substrates:


.Hard materials such as glass, metal, ceramics, stone and crystal.




Features:


1.All transparent Color


2.Adhesion to a wide variety of substrates


3.Full cure at room temperature


4.Good weather resistance, no yellowing


5.100% Solids




Physical Properties of Uncured Adhesive:


Typical Uncured Properties

Part A

Part B

Chemical composition

Epoxy Resin

Amine Hardener

Color

sky blue

Colourless

Viscosity @ 25°C

12,000-18,000mPa.s(cP)

12,000-20,000mPa.s(cP)

Specific gravity

1.12

1.03



Typical Curing Properties:


Mix ratio by volume

1:1

Maximum gap fill

2 mm

Usable / pot life @25°C

25-30mins

Handling time @25°C

35-45 mins

Working strength @25°C

90-120 mins

Full cure @25°C

24 hours




Typical Performance of Cured Adhesive:


Shear strength (mild steel)*(ISO4587)

18-25 N/mm²(1700 - 2600psi)

Peel strength (aluminium)(ISO4578)

10-28 N/25mm (1-4 PIW)

Hardness (ISO868)

75-80 Shore D

Elongation at break (ISO37)

<4%

Glass transition temperature Tg

70-80°C

Dielectric strength

15-25 kv/ mm

Thermal conductivity

0.18 W/(m.K)

Dielectric Strength,ASTM D149,V/mil

1100

Dielectric Constant,MIL 1-16923.K 1kHz

4.28



Handling:


Mixing: This product requires mixing two components together just prior to application. Complete mixing is


necessary. The temperature  of  the  separate components prior to mixing is not critical, but they  should be


close to room temperature.



Application:


Please remove the packing cap and install the mixing tube. Gently push the push rod so that the AB


component can be fully mixed in the mixing tube and evenly extruded and applied to the parts to be


bonded. Products  that  have  been  used  can  be stored in  connection with mixing pipes. To reuse,


remove and discard the old mixing pipe, install a new mixing pipe can be reused.



Bonding surfaces should be clean and dry. Once the adhesive is applied, the bonded parts should be held in


contact  until  the part  has  developed  handling  strength.  It  is  not  necessary  to clamp the parts unless


movement during cure is likely.



Cure:


Complete cure is obtained after three days at room temperature. After 24 hours, approximately 90% of


full cure properties are attained.



Clean Up:


It  is  important  to  remove  excess  adhesive  from  the  work  area  and  application equipment before it


hardens. Many common solvents  are suitable for removing uncured adhesive. Consult with your supplier's


information pertaining to the safe and proper use of solvents.



Packaging:


50 ml and 200 ml Conjoined double tube



GENERAL INFORMATION:


This product is not recommended for use in pure oxygen and/or oxygen rich systems and should not be


selected  as  a  sealant for chlorine or other strong oxidizing materials. For safe handling information on 


this product,consult the Material Safety Data Sheet,(MSDS).



Storage:


Store  product  in  unopened  container  in  a cool dry location. Ideal conditions are within the range 8 to 21


degrees C  (46  to  70  degrees  F )  and  are  recommended  for  long  term  storage.  Exposure  to  higher


temperatures (greater than 28 degrees C) for prolonged periods should  be avoided  as extended  exposure


to warm conditions can adversely affect product properties. For further specific shelf life information,contact


your local Technical Service Center.



Note:


The  data  contained herein are  furnished for information only and are believed to be reliable. We cannot


assume responsibility for the results obtained by others over whose methods we have no control. It is the


user's responsibility to determine suitability for the user's purpose of any production  methods  mentioned


herein and to adopt such precautions as may be advisable for the protection of  property  and of  persons


against any hazards that may be involved in th e handling  and  use  thereof.  In  light  of  the  foregoing,


TIEAKO® specifically disclaims all warranties expressed or implied, including warranties of


merchantability or fitness for a particular purpose,arising from sale or use of TIEAKO® products.


TIEAKO® specifically disclaims  any  liability  for  consequential  or  incidental  damages  of  any


kind, including lost profits. We recommend that each prospective user test his  proposed application


before repetitive use, using this data as a guide.